Union Minister of State for Electronics and Information Technology Jitin Prasada recently updated the nation on the status of various major semiconductor-based projects in India.
Here is a quick list:
1. Micron's Gujarat hub: Micron Technology is establishing a semiconductor manufacturing facility in Gujarat with an investment of Rs 22,516 crore. Micron’s facility in India will enable assembly and test manufacturing for both DRAM and NAND products and address demand from domestic and international markets. The production capacity is around 14 million units per week.
2. Tata Electronics' Gujarat facility: TEPL is establishing semiconductor manufacturing facility in Gujarat with an investment of R. 91,526 crore. The fab facility will be set up in technology partnership with PSMC, Taiwan. The production capacity of the project would be around 50,000 wafer starts per month (WSPM).
3. Tata Electronics' Assam leap: TEPL is establishing a semiconductor manufacturing facility in Assam with an investment of Rs 27,120 crores. The facility will use indigenous semiconductor packaging technologies with a production capacity of 48 million units per day.
4. CG Power's Gujarat bet: CG Power and Industrial Solutions Limited is establishing a semiconductor manufacturing facility in Gujarat with an investment of Rs 7,584 crore. The facility will be set up as a joint venture partnership with Renesas Electronics America Inc., USA, and STARS Microelectronic, Thailand. The Technology would be provided for this facility by Renesas Electronics Corporation, Japan and STARS Microelectronic, Thailand. The production capacity would be around 15.07 million units per day.
5. Kaynes Technology's Gujarat facility: Kaynes Technology India Limited (KTIL) is establishing a semiconductor manufacturing facility in Gujarat with an investment of Rs 3,307 crores for Wire bond Interconnect, Substrate Based Packages. The Technology would be provided by ISO Technology Sdn. Bhd. and AOI Electronics Co. Ltd. (AOI). The facility will have the capacity to produce more than 6.33 million chips per day.
6. Vama Sundari Investments' UP manufacturing: VSIPL is establishing a semiconductor manufacturing facility in Uttar Pradesh with an investment of Rs 3,706 crores for display driver ICs (DDIC) using Gold (Au) Bump technology, along with chip probing facilities and die processing services. The Technology would be provided by Hon Hai, Taiwan. The facility will be set up as a joint venture partnership between VSIPL and Foxconn, India. The production capacity would be around 20K wafers per month to 36 million chips per month.
7. 3DGS's Odisha facility: 3DGlass Solutions Inc is establishing a semiconductor manufacturing facility in Odisha with an investment of Rs 1,943 crores. The plant will handle the assembly of packaged products such as Flip Chip Ball Grid Array (FCBGA) assembly, Radio Frequency System in Package (RF SiP), Antenna in Package System in Package (AiPSiP), glass interposers with passives and silicon bridges and 3D Heterogeneous Integration (3DHI) modules. The proposed installed capacity for glass panel substrate production, assembly and 3DHI is around 5800 panels per month, 4.20 million units per month, and 1100 units per month, respectively.
8. SiCSem's Odisha unit: SiCSem Private Limited is establishing a semiconductor manufacturing facility in Odisha with an investment of Rs 2,066 crores. The facility will be set up in a technology partnership with Clas-SiC Wafer Fab Ltd. for SiC fab and Continental Device India Pvt. Ltd. for packaging. The production capacity is 5,000 wafers/month, and the packaging capacity is 8 million units/month.
9. CDIL's Punjab facility: Continental Device India Private Limited is expanding its semiconductor manufacturing facility in Punjab, with an investment of Rs 117 crores. The facility will manufacturehigh-power discrete semiconductor devices such as MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors, both in Silicon and Silicon Carbide. The production capacity will be around 158.38 million units/annum.
10. ASIP's Andhra Pradesh facility: Advanced System in Package Technologies Private Limited is establishing a semiconductor manufacturing facility in Andhra Pradesh, with an investment of Rs 480 crores. The facility will be set up in a technology partnership with APACT Co., Ltd., South Korea. The production capacity of the facility would be around 96 million units/annum.
Minister Jitin Prasada revealed this list at the Lok Sabha session on Wednesday, as the Centre highlighted the recent approval of 10 projects with expected investments of around Rs 1.6 lakh crore. The projects above include two fabs and eight packaging units.
Apart from these, the ministry also stated that the government supported 24 chip design projects through startups. Out of them, 16 completed tapeouts and 13 received VC funding.