New Delhi, Nov 9 (PTI) Paras Semiconductors, a subsidiary of Paras Defence and Space Technologies, has announced a technology partnership

New Delhi, Nov 9 (PTI) Paras Semiconductors, a subsidiary of Paras Defence and Space Technologies, has announced a technology partnership

New Delhi, Nov 9 (PTI) Paras Semiconductors, a subsidiary of Paras Defence and Space Technologies, has announced a technology partnership

New Delhi, Nov 9 (PTI) Paras Semiconductors, a subsidiary of Paras Defence and Space Technologies, has announced a technology partnership with US-based BroadPak Corporation to develop advanced semiconductor packaging capabilities in India, according to a release on Monday.

     Through the tie-up, Paras Semiconductors aims to set up an advanced heterogeneous integration and 3D packaging OSAT (outsourced semiconductor assembly and test) facility in the country.

     The proposed unit will focus on 2.5D/3D packaging, chiplet integration, hybrid bonding, wafer-level and panel-level fan-out packaging, co-packaged optics, and testing and qualification, the company said.

     Paras Semiconductors will gain access to BroadPak's design, manufacturing and integration intellectual property, along with technology transfer and process know-how. The two firms will also explore joint development of packaging platforms for AI and high-performance computing applications, and collaborate on training Indian engineers.

     BroadPak, headquartered in San Jose, California, was founded in 2007 and brings specialised expertise across advanced packaging design, manufacturing and system integration, according to the release.

     "Our entry into the semiconductor sector represents a strategic expansion into a technology domain that is increasingly critical to India's AI and data centres and industrial capabilities," Munjal Sharad Shah, Managing Director, Paras Defence and Space Technologies, said.

     Paras Semiconductors CEO Santosh Kumar said the company intends to build a packaging platform that can address the performance, connectivity and thermal needs of next-generation applications.

     BroadPak Founder and CEO Farhang Yazdani noted India's growing semiconductor ecosystem offered an important opportunity to develop capabilities in heterogeneous integration and system-level packaging.

     The proposed facility will address high-volume manufacturing and strategic electronics needs, including devices for optical and optronic systems, high-performance computing, networking and data centres.

(This story has not been edited by THE WEEK and is auto-generated from PTI)