The foundation stone for India’s first advanced 3D chip packaging unit was laid at Info Valley in the Khordha district in Bhubaneswar, Odisha, recently. This was the result of a ₹1,943.53 crore investment by 3D Glass Solutions Inc. (3DGS), a US-based semiconductor company, through its Indian subsidiary Heterogeneous Integration Packaging Solutions Private Limited (HIPSPL). Union Minister Ashwini Vaishnaw and Odisha Chief Minister Mohan Charan Majhi were present at the groundbreaking ceremony.
Chip packaging is a critical step in the semiconductor industry. Advanced 3D packaging is the cutting edge of this process, stacking multiple chips and components together in a glass substrate to dramatically improve performance and shrink size.
Until now, India has had no facility capable of doing this on a commercial scale. This plant will be the first.
The facility is designed to produce 69,600 glass panel substrates, 50 million assembled units, and approximately 13,200 advanced 3DHI modules per year, according to the Centre.
Commercial production is targeted to begin by August 2028, with full-scale output by August 2030. The chips produced here will feed into sectors including artificial intelligence, defence electronics, automotive radar, 5G/6G communications, data centres, and aerospace.
Of the ₹1,943.53 crore total investment, the Centre is supporting the project with ₹799 crore in fiscal assistance, and the Odisha state government is adding approximately ₹399.5 crore, together covering nearly 60 per cent of the project cost.
Odisha is now uniquely positioned as the only state in India hosting both the country's first compound semiconductor fabrication unit (being built by SiCSem) and, now, the first 3D glass substrate packaging facility, both on the same industrial campus.
Union Minister Vaishnaw also noted at the event that electronics manufacturing in India grew six-fold over the past 12 years, and that India became the world’s second-largest mobile phone manufacturer.