The Union Cabinet has approved four semiconductor plants, including a unit backed by US technology major Intel and Lockheed Martin, in three states of Odisha, Andhra Pradesh and Punjab.
Union Minister Ashwini Vaishnaw said that the first 'made-in-India chip from an under-construction project is expected to be rolled out within two to three months.
The cabinet approved a 3D Glass semiconductor packaging unit to be set up by Heterogenous Integration Packaging Solutions Pvt Ltd, which is backed by US technology majors such as Intel, Lockheed Martin and Applied Materials, entailing an investment of ₹1,943 crore with an annual production capacity of 5 crore units.
The minister said that a silicon carbide semiconductor plant will be set up in Bhubaneswar with an investment of ₹2,066 crore by SiCsem Pvt Ltd.
A chip packaging plant in Andhra Pradesh, to be set up by Advanced System in Package Technologies with an investment of ₹468 crore, was also approved by the Cabinet.
The cabinet also cleared a semiconductor project of electronics component maker firm CDIL. The facility will be set up in Punjab with an investment of ₹117 crore.
The new semiconductor projects raise the total number of chip plants in India to 10 with cumulative investment commitment of around ₹1.6 lakh crore.